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ANALYSIS OF LEAD-FREE SOLDER JOINT INTERFACE

ANALYSIS OF LEAD-FREE SOLDER JOINT INTERFACE

Solder joining technologies have become increasingly important in the electronics industry in recent years from the viewpoints of miniaturization of electronic components and wide adoption of lead-free solder alloys. This article introduces an example of analysis of the solder joint interface of a printed wiring board on which components were mounted with a lead-free solder alloy (Sn-3.0Ag-0.5Cu) and a crack in the solderusing a Shimadzu EPMA™ electron probe microanalyzer (EPMA-8050G, hereinafter, EPMA).

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