Shimadzu Corporation announces today the release of its inspeXio SMX-225CT FPD HR microfocus X-ray CT system. Equipped with a large high-resolution flat panel detector, this system is capable of obtaining 3D images with an industry-leading wide imaging field of view and high resolution excellent, it can use to examinations, and failure analysis with respect to automotive parts, electronic equipment, and lithium ion batteries…
Some features of the new system, such as:
- Obtains Highly Detailed, High Contrast Cross-Sectional Images: this system achieves an input resolution equivalent to an industry-leading maximum of 14 million pixels.
- Enlarged Maximum Imaging Region and Maximum Sample Size : the maximum sample weight has been increased from 9 kg to 12 kg, the maximum imaging region has been enlarged by approximately 60%
- Software Operability and Rapidity
With features and performance characteristics compared with equivalent devices, this device can easily reconstruct the 3D structure of the object and obtains the internal structure and cross-sectional images of composite resin materials, such as previously hard-to-observe glass fiber reinforced plastics (GFRP),carbon fiber reinforced thermoplastics (CFRTP)…
Sample’s 3D imaging data (left: aluminum die cast defect analysis; right: GFRP fiber orientation analysis)